Warning: I am able to write to the configuration file: /home/bgachipc/public_html/includes/configure.php. This is a potential security risk - please set the right user permissions on this file (read-only, CHMOD 644 or 444 are typical). You may need to use your webhost control panel/file-manager to change the permissions effectively. Contact your webhost for assistance. 
Welcome to BGA-CHIP.com your worldwide source for online shopping and sourcing of bga chips, DIP, PLCC, TSOP, QFP, SOP, SOIC, SSOP, TSSOP and other packages.
We ship worldwide and will eventually put our main stock lines on this new online database.
(Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. BGA chips are easier to align to the printed circuit board, because the leads, which are called "solder balls" or "solder bumps," are farther apart than leaded packages. Since the leads are underneath the chip, BGA has led the way to chip scale packaging (CSP) where the package is not more than 1.2x the size of the semiconductor die itself
click on the picture to see our main factory site and trade counter
